설명
2200evo Master Module DC000009 Belt transport system C-type Qty 1 DC000012 Substrate heating at MAIN axis for C-type TS (excl. heated p-part) Qty 1 DC2108 Wafer table with stretcher (w/o frame down-holding application) Qty 1 DC2118 Frame down-holding application 8" (for DC2108) Qty 1 DC350015 Standard FoV SC (4,5 x 4,5 mm) Qty 1 DC350017 Standard FoV UC (4,5 x 4,5 mm) Qty 1 DC3518 Upgrade to dual-FoV WC (5 x 5 mm & 12 x 12 mm) Qty 1 DC350010 Wafer camera full moon ring light Qty 1 DC4118 Upgrade to heated bond head Qty 1 DC4308 Tool changer unit 7 slots Qty 1 DC5008 Single die ejection unit Qty 1 DC5108 Upgrade to multi die ejection carousel (requires DC5008) Qty 1 DC600010 MAIN - high performance p/t dispenser (PDS) Qty 1 DC600012 MAIN - high performance pre-dispensing plate Qty 1 DC700010 Safety labels in English Qty 1 DC7918 Connection kit (tubes, fittings, cables, ...) Qty 1 DC0518 P-part at MAIN axis Qty 4 DC250002 4" WP-Adapter - (8"-FF108) - 2 up - top clamp (any WT) Qty 1 DC4808 Standard tool holder (without shank and tip) Qty 3 DC4960 Pick & place or epoxy stamping tools (off the shelf, no customizing) Qty 2 DC450002 Customized tool tip Qty 1 DC550001 Eject tool base D20 Qty 2 DC5038 Multi-pin kit for eject tools Qty 2 TOOLEVO Standard tooling Qty 1 DC700007 Calibration / Lubrication kit Qty 1 DC700009 Microscope Qty 1 DC7518 Step-up transformer Qty 1 DC5302 Installation at customer site North America Qty 1 DC900001 Specific training at customer site Asia / US Qty 1 DC2008 Wafer table without stretcher Qty 1 DC0528 Heated p-part at MAIN axis Qty 1환경 설정
Datacon 2200 evo Flexible multi-chip die bonder with high accuracy and high productivity Dynamic XYZ & Theta servo motors Machine capability 10 pm @ 3s Besi in-house developed pattern and fiducial recognition system incl image processing unit Progammable lighting system with RGB (partial) CMOS camera/optic/illumination (various camera systems based on configuration) Substrate handling and transporting system Component presentation system (based on configuration) Bondforce sensor and Mini-BMC kit (0.0045° resolution) ETX based industry PC with Linux GUI (supports all modules)OEM 모델 설명
The Datacon 2200 evo is a high-accuracy multi-chip die bonder designed to offer exceptional flexibility for die attach and flip chip applications in the semiconductor industry. It comes equipped with advanced features such as an integrated dispenser, 12-inch wafer handling capability, automatic tool changer, and application-specific tooling. The machine is well-prepared to handle a wide range of present and future processes and products, making it a versatile and reliable choice for semiconductor manufacturing.문서
문서 없음
카테고리
Die Bonders / Sorters / Attachers
마지막 검증일: 3일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
130043
웨이퍼 사이즈:
알 수 없음
빈티지:
2023
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
BESI / DATACON
2200 EVO
카테고리
Die Bonders / Sorters / Attachers
마지막 검증일: 3일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
130043
웨이퍼 사이즈:
알 수 없음
빈티지:
2023
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
2200evo Master Module DC000009 Belt transport system C-type Qty 1 DC000012 Substrate heating at MAIN axis for C-type TS (excl. heated p-part) Qty 1 DC2108 Wafer table with stretcher (w/o frame down-holding application) Qty 1 DC2118 Frame down-holding application 8" (for DC2108) Qty 1 DC350015 Standard FoV SC (4,5 x 4,5 mm) Qty 1 DC350017 Standard FoV UC (4,5 x 4,5 mm) Qty 1 DC3518 Upgrade to dual-FoV WC (5 x 5 mm & 12 x 12 mm) Qty 1 DC350010 Wafer camera full moon ring light Qty 1 DC4118 Upgrade to heated bond head Qty 1 DC4308 Tool changer unit 7 slots Qty 1 DC5008 Single die ejection unit Qty 1 DC5108 Upgrade to multi die ejection carousel (requires DC5008) Qty 1 DC600010 MAIN - high performance p/t dispenser (PDS) Qty 1 DC600012 MAIN - high performance pre-dispensing plate Qty 1 DC700010 Safety labels in English Qty 1 DC7918 Connection kit (tubes, fittings, cables, ...) Qty 1 DC0518 P-part at MAIN axis Qty 4 DC250002 4" WP-Adapter - (8"-FF108) - 2 up - top clamp (any WT) Qty 1 DC4808 Standard tool holder (without shank and tip) Qty 3 DC4960 Pick & place or epoxy stamping tools (off the shelf, no customizing) Qty 2 DC450002 Customized tool tip Qty 1 DC550001 Eject tool base D20 Qty 2 DC5038 Multi-pin kit for eject tools Qty 2 TOOLEVO Standard tooling Qty 1 DC700007 Calibration / Lubrication kit Qty 1 DC700009 Microscope Qty 1 DC7518 Step-up transformer Qty 1 DC5302 Installation at customer site North America Qty 1 DC900001 Specific training at customer site Asia / US Qty 1 DC2008 Wafer table without stretcher Qty 1 DC0528 Heated p-part at MAIN axis Qty 1환경 설정
Datacon 2200 evo Flexible multi-chip die bonder with high accuracy and high productivity Dynamic XYZ & Theta servo motors Machine capability 10 pm @ 3s Besi in-house developed pattern and fiducial recognition system incl image processing unit Progammable lighting system with RGB (partial) CMOS camera/optic/illumination (various camera systems based on configuration) Substrate handling and transporting system Component presentation system (based on configuration) Bondforce sensor and Mini-BMC kit (0.0045° resolution) ETX based industry PC with Linux GUI (supports all modules)OEM 모델 설명
The Datacon 2200 evo is a high-accuracy multi-chip die bonder designed to offer exceptional flexibility for die attach and flip chip applications in the semiconductor industry. It comes equipped with advanced features such as an integrated dispenser, 12-inch wafer handling capability, automatic tool changer, and application-specific tooling. The machine is well-prepared to handle a wide range of present and future processes and products, making it a versatile and reliable choice for semiconductor manufacturing.문서
문서 없음