설명
Fully functional, in production clean room환경 설정
6, 8 and 12in wafer mounted on 17 in frameOEM 모델 설명
Mi20 is a full specification platform designed for wafer to reel process in WLCSP. Below are the key features of Mi20: • Provides throughput up to 20,000 UPH • Handles 12" wafer or below • Ability to handle die size of 0.3 x 0.3 mm or larger문서
MI EQUIPMENT
MI20
검증됨
카테고리
Die Bonders / Sorters / Attachers
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Installed / Running
제품 ID:
106566
웨이퍼 사이즈:
6"/150mm, 8"/200mm, 12"/300mm
빈티지:
2016
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
MI EQUIPMENT
MI20
카테고리
Die Bonders / Sorters / Attachers
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Installed / Running
제품 ID:
106566
웨이퍼 사이즈:
6"/150mm, 8"/200mm, 12"/300mm
빈티지:
2016
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available