The ASM IS868LA2 is a die bonder machine used in the semiconductor industry for attaching semiconductor chips to a substrate

ASM is a supplier of semiconductor process equipment for wafer processing, including lithography, deposition, ion implant and single-wafer epitaxy. ASM is part of the ASM International NV group that also includes ASM Pacific Technology (ASMPT). ASMPT, in which ASMI holds a substantial ownership is a leading supplier of semiconductor process equipment for wafer assembly and packaging, and for surface mount technology.



IS868LA2

카테고리

개요

활성 등재물

서비스

상위 등재물

Moov에 등재하고 즉시 완벽한 구매자를 찾으십시오.