설명
CENTURA HTF Doping & Thickness Uniformity Wafer Size Range Minimum 200 mm Maximum 200 mm Set Size 200 mm Cassette to Cassette YES Exterior Dimensions Width 196.850 in (500.0 cm) Depth 70.866 in (180.0 cm) Height 106.299 in (270.0 cm) Weight 7,716 lb (3,500 kg)환경 설정
환경 설정 없음OEM 모델 설명
The Centura is Applied’s most versatile platform. Launched in 1992, over 8,000 Centura systems have been shipped to customers around the world. For ≤200mm fabrication the applications supported include CVD, epitaxy, etch, plasma nitridation and RTP. In September 1992, AMAT announced its latest generation single-wafer, multichamber platform, the Centura, to target the high temperature thin films market as well as future process applications with 0.5 micron and below specifications.문서
문서 없음
카테고리
Dry / Plasma Etch
마지막 검증일: 11일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
147420
웨이퍼 사이즈:
알 수 없음
빈티지:
2006
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
APPLIED MATERIALS (AMAT)
CENTURA
카테고리
Dry / Plasma Etch
마지막 검증일: 11일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
147420
웨이퍼 사이즈:
알 수 없음
빈티지:
2006
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
CENTURA HTF Doping & Thickness Uniformity Wafer Size Range Minimum 200 mm Maximum 200 mm Set Size 200 mm Cassette to Cassette YES Exterior Dimensions Width 196.850 in (500.0 cm) Depth 70.866 in (180.0 cm) Height 106.299 in (270.0 cm) Weight 7,716 lb (3,500 kg)환경 설정
환경 설정 없음OEM 모델 설명
The Centura is Applied’s most versatile platform. Launched in 1992, over 8,000 Centura systems have been shipped to customers around the world. For ≤200mm fabrication the applications supported include CVD, epitaxy, etch, plasma nitridation and RTP. In September 1992, AMAT announced its latest generation single-wafer, multichamber platform, the Centura, to target the high temperature thin films market as well as future process applications with 0.5 micron and below specifications.문서
문서 없음