설명
Details Attached Hitachi High-Technologies HS 9050 Dry Etch / Plasma Asher환경 설정
configured for high-current operation (150A, 3Ø AC 208V). This 12” multi-chamber platform comprises: Five Asher / Etch chambers Two Cooling chambers Integrated transfer modules Mini-Environment Wafer Loading Module (EFEM) The system is configured for copper processing. Engineered for precision processing, optimizing etching and ashing capabilities in semiconductor applications.OEM 모델 설명
HS-9050 is equipped with a gas system compatible with both organic and inorganic films. Processing can be flexibly set based on the structure of the film layers, enabling the entire removal process of multilayer resists in next-generation devices to be performed within the same chamber. Meanwhile, helical downflow plasma has been newly adopted as the plasma source, resulting in a highly efficient, less damaging process.문서
유사 등재물
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HITACHI
HS-9050
카테고리
Dry / Plasma Etch
마지막 검증일: 오늘
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
143410
웨이퍼 사이즈:
12"/300mm
빈티지:
2019
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available