설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
HS-9050 is equipped with a gas system compatible with both organic and inorganic films. Processing can be flexibly set based on the structure of the film layers, enabling the entire removal process of multilayer resists in next-generation devices to be performed within the same chamber. Meanwhile, helical downflow plasma has been newly adopted as the plasma source, resulting in a highly efficient, less damaging process.문서
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HITACHI
HS-9050
카테고리
Dry / Plasma Etch
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
125770
웨이퍼 사이즈:
알 수 없음
빈티지:
2019
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설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
HS-9050 is equipped with a gas system compatible with both organic and inorganic films. Processing can be flexibly set based on the structure of the film layers, enabling the entire removal process of multilayer resists in next-generation devices to be performed within the same chamber. Meanwhile, helical downflow plasma has been newly adopted as the plasma source, resulting in a highly efficient, less damaging process.문서
문서 없음