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설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
The Rainbow® 4520i system is a single wafer, vacuum load-locked low pressure oxide system with two active processing chambers. It is designed for integrated isotropic/anisotropic profile on high aspect ratio contact and via structures. The Isotropic Module adds isotropic oxide etching capabilities to the existing anisotropic capabilities of the Rainbow 4520, providing excellent aluminum step coverage. The Isotropic Module is incorporated onto the entrance load-lock on the Rainbow 4520, requiring only one additional wafer handling step. Having two chambers on a single machine greatly reduces the possibility of cross contamination between processes, which minimizes wafer breakage and defect densities. The system has a high uptime of ≥ 85% and is capable of isotropic etching for dielectric (oxide) films. The Rainbow® 4520i system has several applications, including contact etch, planarization, via etch, trench mask etch, and pad etch.문서
문서 없음
카테고리
Dry / Plasma Etch
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
98955
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
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LAM RESEARCH CORPORATION
RAINBOW 4520i
카테고리
Dry / Plasma Etch
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
98955
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
The Rainbow® 4520i system is a single wafer, vacuum load-locked low pressure oxide system with two active processing chambers. It is designed for integrated isotropic/anisotropic profile on high aspect ratio contact and via structures. The Isotropic Module adds isotropic oxide etching capabilities to the existing anisotropic capabilities of the Rainbow 4520, providing excellent aluminum step coverage. The Isotropic Module is incorporated onto the entrance load-lock on the Rainbow 4520, requiring only one additional wafer handling step. Having two chambers on a single machine greatly reduces the possibility of cross contamination between processes, which minimizes wafer breakage and defect densities. The system has a high uptime of ≥ 85% and is capable of isotropic etching for dielectric (oxide) films. The Rainbow® 4520i system has several applications, including contact etch, planarization, via etch, trench mask etch, and pad etch.문서
문서 없음