설명
설명 없음환경 설정
V.C PlatformOEM 모델 설명
The Aspen III’s exceptional platform design can handle both 200 mm and 300 mm wafers, and supports special wafer handling including warped and translucent wafers. The unique process chamber architecture can accommodate technical requirements across multiple technology nodes for the most demanding device manufacturers in the industry.문서
문서 없음
유사 등재물
모두 보기
MATTSON
ASPEN III
카테고리
Dry / Plasma Etch
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
129945
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
V.C PlatformOEM 모델 설명
The Aspen III’s exceptional platform design can handle both 200 mm and 300 mm wafers, and supports special wafer handling including warped and translucent wafers. The unique process chamber architecture can accommodate technical requirements across multiple technology nodes for the most demanding device manufacturers in the industry.문서
문서 없음