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설명
DRIE환경 설정
환경 설정 없음OEM 모델 설명
With market leading etch rates using a conventional de-coupled plasma source, the HRM provides a cost effective Deep Reactive lon Etch (DRIE) processing chamber. Designed to offer high etch rates while controlling ion damage, the HRM is ideal for deep anisotropic silicon etching using STS' ASE® process technology.문서
문서 없음
STS
HRM
카테고리
Dry / Plasma Etch
마지막 검증일: 5일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
126145
웨이퍼 사이즈:
4"/100mm, 6"/150mm, 8"/200mm
빈티지:
알 수 없음
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설명
DRIE환경 설정
환경 설정 없음OEM 모델 설명
With market leading etch rates using a conventional de-coupled plasma source, the HRM provides a cost effective Deep Reactive lon Etch (DRIE) processing chamber. Designed to offer high etch rates while controlling ion damage, the HRM is ideal for deep anisotropic silicon etching using STS' ASE® process technology.문서
문서 없음