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The tool uses cassette to cassette load and unload. 6-inch wafer cassettes are used with 25 slots for automated load and handling. Gases - O2, CF4, SF6 and Ar. Purge gas for the chamber was N2 Tool was used for descum of resist residues before post processing and general resist strip using oxygen plasmas. Processes were created for Nitride using a chemistry of CF4/O2 and was proved effective for SiN etching.OEM 모델 설명
The Tegal 901e is an inline RIE/plasma production etcher for six-inch wafers. It is a single-wafer, cassette-to-cassette driven tool with easy-to-use menu control and a 13.56 MHz RF Generator. The input gases are controlled by MFC, with up to 4 MFCs in the system. This tool implements multi-step etch recipes using multiple process gases and has been optimized for specific etches of specific films. Gases available in this configuration are N2, O2, SF6, CHF3, and CF4. The Tegal 901e plasma etcher is used by the semiconductor industry for integrated circuit fabrication. It is an industry standard in single-wafer dry etch of silicon nitride, polysilicon, amorphous silicon, and silicon oxide. Wafers are transported to a reaction chamber utilizing a non-friction spatula wafer transport mechanism. A gas mixture is introduced into the Reaction Chamber and becomes reactive by the application of radio frequency (RF) electromagnetic radiation. The reactive mixture, or plasma, etches away material that is not covered by the masking photoresist. The etch process is terminated at an appropriate time, the wafer is unloaded from the reaction chamber, and a new wafer is introduced repeating the cycle until all wafers have been processed.문서
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TEGAL
901E
카테고리
Dry / Plasma Etch
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Deinstalled
제품 ID:
127564
웨이퍼 사이즈:
6"/150mm
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available