설명
Physical Specifications Main Unit: 44"W x 42"D x 26"H (112cm x 107cm x 66cm) Weight: 500lb (227kg) NOT INCLUDE VACUUM PUMP AND CHILLERS.환경 설정
Wafer Sizes (Customized) Handles 3”(75mm), 4”(100mm), 5”(125mm), 6”(150mm) Silicon. Proven reactor chamber assembly with upper and lower electrode. Original belt system for Super Spatulas and Shuttle wafer transfer Substrate Positioning Processing directly on cooled wafer chuck. RF Matching Network 13.56 MHz fully automated. Solid State RF Generator ENI ACG-10B 13.56MHz. RF power: 50 to 1000 watts Typical Temperature controller with Julabo chiller 0-80°C. Original AC/DC power supply Tegal box. Gas Control, 4 independent gas line with 4 MFCs (Customized). Pressure Pressure Control Accurate, closed-loop pressure control with UPC and MKS Baratron capacitance pressure manometer. Process pressure 0 - 5000 mTorr. Front and rears touch screen monitor Tegal 90X Integrated Flat Panel Display • On-Screen 9XX System Schematics • Repair & Maintenance Data Files Included. Real-Time graphics Endpoint display. System functions Real-Time process data acquisition on display. Optical Endpoint Parameters. Absolute endpoint time system. Timed cycles up to 4 hour each Wafer quartz pins up/down Calibration and Built-in diagnostic functions. Recipe creation for fully automatic wafer processing. SEC/GEM communication function Rev. II Multi level password protections. Storage of 20 recipes Configuration system, Process Data and Recipe storage on a EEprom. Physical Specifications Main Unit: 44"W x 42"D x 26"H (112cm x 107cm x 66cm) Weight: 500lb (227kg) NOT INCLUDE VACUUM PUMP AND CHILLERS. Facility RequirementsOEM 모델 설명
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TEGAL
903
카테고리
Dry / Plasma Etch
마지막 검증일: 어제
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
140566
웨이퍼 사이즈:
3"/75mm, 4"/100mm, 5"/125mm, 6"/150mm
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Physical Specifications Main Unit: 44"W x 42"D x 26"H (112cm x 107cm x 66cm) Weight: 500lb (227kg) NOT INCLUDE VACUUM PUMP AND CHILLERS.환경 설정
Wafer Sizes (Customized) Handles 3”(75mm), 4”(100mm), 5”(125mm), 6”(150mm) Silicon. Proven reactor chamber assembly with upper and lower electrode. Original belt system for Super Spatulas and Shuttle wafer transfer Substrate Positioning Processing directly on cooled wafer chuck. RF Matching Network 13.56 MHz fully automated. Solid State RF Generator ENI ACG-10B 13.56MHz. RF power: 50 to 1000 watts Typical Temperature controller with Julabo chiller 0-80°C. Original AC/DC power supply Tegal box. Gas Control, 4 independent gas line with 4 MFCs (Customized). Pressure Pressure Control Accurate, closed-loop pressure control with UPC and MKS Baratron capacitance pressure manometer. Process pressure 0 - 5000 mTorr. Front and rears touch screen monitor Tegal 90X Integrated Flat Panel Display • On-Screen 9XX System Schematics • Repair & Maintenance Data Files Included. Real-Time graphics Endpoint display. System functions Real-Time process data acquisition on display. Optical Endpoint Parameters. Absolute endpoint time system. Timed cycles up to 4 hour each Wafer quartz pins up/down Calibration and Built-in diagnostic functions. Recipe creation for fully automatic wafer processing. SEC/GEM communication function Rev. II Multi level password protections. Storage of 20 recipes Configuration system, Process Data and Recipe storage on a EEprom. Physical Specifications Main Unit: 44"W x 42"D x 26"H (112cm x 107cm x 66cm) Weight: 500lb (227kg) NOT INCLUDE VACUUM PUMP AND CHILLERS. Facility RequirementsOEM 모델 설명
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