설명
설명 없음환경 설정
3 x FOUP (25 wafers) ULPA filters Control Monitor Maintenance monitor 10 chamber mainframe CP1 Bevel Etch / Clean CP2 Bevel Etch / Clean CP3 ECD Cu CP4 ECD Cu CP5 ECD Cu CP6 ECD Cu CP7 ECD Cu CP8 ECD Cu CP9 Bevel Etch / Clean CP10 Bevel Etch / Clean Tank 1 (20 liter) Process Tank 2 (10 liter) Mix Tank3 (180 liter) Cathaolyte RTA profile Voltage variation analysis Spectrology analyst RTA probe Voltage variation analysts Spectrology analyst Tan 4 (65 liters) – Anolyte Ph probe Spectrology analyst Fire SuppressioOEM 모델 설명
The Raider™ ECD310 is a fourth-generation, single-wafer, automated, multi-process electrochemical deposition tool. It delivers advanced metal processing in a small footprint and is available with cluster modules for metrology, plating, and cleaning. The Raider™ ECD310 incorporates programmable reactors that provide an ECD seed layer, a full solution for copper fill with uniformity and film characteristics, and integrated removal of all backside, bevel, and edge copper contamination and seed layer edge exclusion etch. Additionally, in-situ anneal is available. This tool is designed to deliver advanced metal processing capabilities in a compact package.문서
문서 없음
APPLIED MATERIALS (AMAT) / SEMITOOL
RAIDER ECD310
검증됨
카테고리
Electro Plating
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
113539
웨이퍼 사이즈:
12"/300mm
빈티지:
2009
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
APPLIED MATERIALS (AMAT) / SEMITOOL
RAIDER ECD310
카테고리
Electro Plating
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
113539
웨이퍼 사이즈:
12"/300mm
빈티지:
2009
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
3 x FOUP (25 wafers) ULPA filters Control Monitor Maintenance monitor 10 chamber mainframe CP1 Bevel Etch / Clean CP2 Bevel Etch / Clean CP3 ECD Cu CP4 ECD Cu CP5 ECD Cu CP6 ECD Cu CP7 ECD Cu CP8 ECD Cu CP9 Bevel Etch / Clean CP10 Bevel Etch / Clean Tank 1 (20 liter) Process Tank 2 (10 liter) Mix Tank3 (180 liter) Cathaolyte RTA profile Voltage variation analysis Spectrology analyst RTA probe Voltage variation analysts Spectrology analyst Tan 4 (65 liters) – Anolyte Ph probe Spectrology analyst Fire SuppressioOEM 모델 설명
The Raider™ ECD310 is a fourth-generation, single-wafer, automated, multi-process electrochemical deposition tool. It delivers advanced metal processing in a small footprint and is available with cluster modules for metrology, plating, and cleaning. The Raider™ ECD310 incorporates programmable reactors that provide an ECD seed layer, a full solution for copper fill with uniformity and film characteristics, and integrated removal of all backside, bevel, and edge copper contamination and seed layer edge exclusion etch. Additionally, in-situ anneal is available. This tool is designed to deliver advanced metal processing capabilities in a compact package.문서
문서 없음