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OxideOEM 모델 설명
The 2300 Exelan is a dielectric etch system introduced in November 2000, designed to process both 200mm and 300mm wafers. It combines Dual Frequency Confined™ (DFC™) plasma technology with state-of-the-art chamber design to provide advanced process performance for copper conductive lines creation, latest generation insulating films, and high aspect ratio applications. It features the industry’s largest dielectric etch portfolio and is capable of meeting the challenges of new materials and reduced geometries at the 130nm technology node and below.문서
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LAM RESEARCH CORPORATION
2300 EXELAN
검증됨
카테고리
Etch/Asher
마지막 검증일: 29일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
92340
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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LAM RESEARCH CORPORATION
2300 EXELAN
카테고리
Etch/Asher
마지막 검증일: 29일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
92340
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
OxideOEM 모델 설명
The 2300 Exelan is a dielectric etch system introduced in November 2000, designed to process both 200mm and 300mm wafers. It combines Dual Frequency Confined™ (DFC™) plasma technology with state-of-the-art chamber design to provide advanced process performance for copper conductive lines creation, latest generation insulating films, and high aspect ratio applications. It features the industry’s largest dielectric etch portfolio and is capable of meeting the challenges of new materials and reduced geometries at the 130nm technology node and below.문서
문서 없음