RIE set up for GaN Etch

330mm Platen

RF Power: 600W, 13.56MHz

Water cooled electrode 10C-80C

Load Lock with turbo pump

End point detection: Verity Optical emission spectroscopy (200-800nm)


Gas pod with 6 lines including following MFCs:
Ar      - 100sccm
CL     - 100sccm
BCL3 - 100sccm
N2O   - 100sccm

Windows PC , user friendly interface

OXFORD

The Oxford Plasmalab 133 is a system used for plasma etching through a process called Reactive Ion Etching (RIE). This refurbished system is designed for GaN etching and has a platen that measures 330mm. It has an RF power of 600W at a frequency of 13.56MHz and features a water-cooled electrode that can operate within a temperature range of 10°C to 80°C. The system also includes a load lock with a turbo pump and an end-point detection system that utilizes Verity Optical emission spectroscopy within the range of 200-800nm. The gas pod of the system has six lines, including mass flow controllers for gases such as Ar, CL, BCL3, and N2O.

OXFORD

PLASMALAB 133

PECVD

유사 등재물

OXFORD

PLASMALAB 133

OXFORD

PLASMALAB 133

OXFORD

PLASMALAB 133

OXFORD

PLASMALAB 133

OXFORD

PLASMALAB 133

OXFORD

PLASMALAB 133

PLASMALAB 133

PECVD

유사 등재물

OXFORD

PLASMALAB 133

OXFORD

PLASMALAB 133

OXFORD

PLASMALAB 133

OXFORD

PLASMALAB 133

OXFORD

PLASMALAB 133

OXFORD

PLASMALAB 133