RIE set up for SiO2 Etch

330mm Platen

RF Generator:  Advanced Energy RFX 600A ;  600W, 13.56MHz, 

Chamber Turbo pump: Alcatel ATH 400M  w/ ACT 600M controller

Blue color PLC type

Water cooled electrode 10C-80C

Gas pod with 6 lines including following MFCs:
Ar      - 100sccm
N2     - 200sccm
CHF3 - 200sccm
NF3   - 200sccm
N2O  - 200sccm

Windows PC , user friendly interface

Ebara Roughing pumps were utilized by previous user (NOT INCLUDED)

Lauda WK 1200 Chiller was utilized by previous user (NOT INCLUDED)

OXFORD

The Oxford Plasmalab 133 is a system used for plasma etching through a process called Reactive Ion Etching (RIE). This refurbished system is designed for GaN etching and has a platen that measures 330mm. It has an RF power of 600W at a frequency of 13.56MHz and features a water-cooled electrode that can operate within a temperature range of 10°C to 80°C. The system also includes a load lock with a turbo pump and an end-point detection system that utilizes Verity Optical emission spectroscopy within the range of 200-800nm. The gas pod of the system has six lines, including mass flow controllers for gases such as Ar, CL, BCL3, and N2O.

OXFORD

PLASMALAB 133

PECVD

유사 등재물

OXFORD

PLASMALAB 133

OXFORD

PLASMALAB 133

OXFORD

PLASMALAB 133

OXFORD

PLASMALAB 133

OXFORD

PLASMALAB 133

OXFORD

PLASMALAB 133

PLASMALAB 133

PECVD

유사 등재물

OXFORD

PLASMALAB 133

OXFORD

PLASMALAB 133

OXFORD

PLASMALAB 133

OXFORD

PLASMALAB 133

OXFORD

PLASMALAB 133

OXFORD

PLASMALAB 133