설명
Die Bonder / Flip Chip Bonder Dual Head환경 설정
Die Bonding machine for passive alignment accuracy less than 1um placementOEM 모델 설명
The NOVA Plus High Speed Dual Head Die Bonder & Flip Chip Bonder offers a wide range of features including: -High precision die bonder/flip chip bonder -Accuracy +/-2.5m @ 3 sigma -Cycle-time of < 3 sec* -Modular machine concept for all micro assembly applications -Eutectic bonding via diode-laser, a heating plate or epoxy stamping and dispensing -Multi flip chip bonding -Wafer mapping -Post bond inspection/measurement -Substrate working area of 550x600mm -Active bond-force-control문서
문서 없음
카테고리
Flip Chip Bonders
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Deinstalled
제품 ID:
149015
웨이퍼 사이즈:
알 수 없음
빈티지:
2018
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ASMPT
AMICRA NOVA PLUS
카테고리
Flip Chip Bonders
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Deinstalled
제품 ID:
149015
웨이퍼 사이즈:
알 수 없음
빈티지:
2018
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Die Bonder / Flip Chip Bonder Dual Head환경 설정
Die Bonding machine for passive alignment accuracy less than 1um placementOEM 모델 설명
The NOVA Plus High Speed Dual Head Die Bonder & Flip Chip Bonder offers a wide range of features including: -High precision die bonder/flip chip bonder -Accuracy +/-2.5m @ 3 sigma -Cycle-time of < 3 sec* -Modular machine concept for all micro assembly applications -Eutectic bonding via diode-laser, a heating plate or epoxy stamping and dispensing -Multi flip chip bonding -Wafer mapping -Post bond inspection/measurement -Substrate working area of 550x600mm -Active bond-force-control문서
문서 없음