설명
설명 없음환경 설정
-Poly Furnace (Zro HiK process) -300 mm Production with Max production 100Pcs -2 IO Port ,18 Carrier Stock -Waves System CTL , Temp CTL M560 -Heater Type : VMU series , -Fork Transfer with 4+1 -2 Boat -Gas :N2,SiH4, AsH3/H2OEM 모델 설명
TELINDY PLUS™ is a cutting-edge thermal processing technology that combines the best features of the TELFORMULA™ minibatch system and the previous generation TELINDY™ platform. It offers improved process performance and productivity, with new enhancements such as improved maintenance access, dry gas chamber cleaning, and low O2 environment loading area control. These features contribute to yield increases by managing small particles more effectively. The highest levels of productivity are achieved by combining a 125 wafer load size with TEL’s FTPS™ responsive heater and a dual boat system option. TELINDY PLUS™ can be used for a wide range of applications, from traditional silicon treatments to leading edge ALD processes and radical oxidation. It represents the convergence of demonstrated experience and advanced technology, making it a powerful tool for thermal processing.문서
문서 없음
TEL / TOKYO ELECTRON
TELINDY PLUS
검증됨
카테고리
Furnaces / Diffusion
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
65729
웨이퍼 사이즈:
12"/300mm
빈티지:
2009
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기TEL / TOKYO ELECTRON
TELINDY PLUS
카테고리
Furnaces / Diffusion
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
65729
웨이퍼 사이즈:
12"/300mm
빈티지:
2009
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
-Poly Furnace (Zro HiK process) -300 mm Production with Max production 100Pcs -2 IO Port ,18 Carrier Stock -Waves System CTL , Temp CTL M560 -Heater Type : VMU series , -Fork Transfer with 4+1 -2 Boat -Gas :N2,SiH4, AsH3/H2OEM 모델 설명
TELINDY PLUS™ is a cutting-edge thermal processing technology that combines the best features of the TELFORMULA™ minibatch system and the previous generation TELINDY™ platform. It offers improved process performance and productivity, with new enhancements such as improved maintenance access, dry gas chamber cleaning, and low O2 environment loading area control. These features contribute to yield increases by managing small particles more effectively. The highest levels of productivity are achieved by combining a 125 wafer load size with TEL’s FTPS™ responsive heater and a dual boat system option. TELINDY PLUS™ can be used for a wide range of applications, from traditional silicon treatments to leading edge ALD processes and radical oxidation. It represents the convergence of demonstrated experience and advanced technology, making it a powerful tool for thermal processing.문서
문서 없음