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설명
Indy BM Poly / Indy IL ALD SIN / Indy AL LPRO (FTPS , RCU , option)환경 설정
FuranceOEM 모델 설명
The TELINDY is a 300mm wafer processing platform that combines the advantages of the TELFORMULA and ALPHA(α)-303i platforms to meet the demands of high-volume thermal processing for sub-45nm technology. It offers a large 125-wafer batch size, high-speed robotics, and other improvements for cost-effective processing of various oxidation and deposited films. The TELINDY platform is suitable for a range of applications, including general oxidation/anneal, radical oxidation, LPCVD films, ultra-low temperature LPCVD applications, and high-k dielectrics. It features in-situ dry gas cleaning technology, a fast ramp-up and cool-down heater, high-speed robotics, and a large 125-wafer load size. These features make the TELINDY an excellent choice for cost-effective and efficient wafer processing.문서
문서 없음
PREFERRED
SELLER
카테고리
Furnaces / Diffusion
마지막 검증일: 14일 전
Buyer pays 12% premium of final sale price
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
103655
웨이퍼 사이즈:
12"/300mm
Process:
Indy Poly / Indy ALD SIN / Indy LPRO (FTPS , RCU , option)
빈티지:
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
PREFERRED
SELLER
TEL / TOKYO ELECTRON
TELINDY
카테고리
Furnaces / Diffusion
마지막 검증일: 14일 전
Buyer pays 12% premium of final sale price
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
103655
웨이퍼 사이즈:
12"/300mm
Process:
Indy Poly / Indy ALD SIN / Indy LPRO (FTPS , RCU , option)
빈티지:
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Indy BM Poly / Indy IL ALD SIN / Indy AL LPRO (FTPS , RCU , option)환경 설정
FuranceOEM 모델 설명
The TELINDY is a 300mm wafer processing platform that combines the advantages of the TELFORMULA and ALPHA(α)-303i platforms to meet the demands of high-volume thermal processing for sub-45nm technology. It offers a large 125-wafer batch size, high-speed robotics, and other improvements for cost-effective processing of various oxidation and deposited films. The TELINDY platform is suitable for a range of applications, including general oxidation/anneal, radical oxidation, LPCVD films, ultra-low temperature LPCVD applications, and high-k dielectrics. It features in-situ dry gas cleaning technology, a fast ramp-up and cool-down heater, high-speed robotics, and a large 125-wafer load size. These features make the TELINDY an excellent choice for cost-effective and efficient wafer processing.문서
문서 없음