설명
Tel Indy IRAD환경 설정
Asset Description: TEL Furnace Software Version: 6.01 CIM: secs-gem Process: MLD Nitride Main System: Tel Indy Mainframe (1) Factory Interface: FOUP (2) Options System: Gas Detector box (1) Options System: RCU (Rapid Cooling Unit) (1) 208VAC UPS (1) Rapid cooling unit (1)OEM 모델 설명
The TELINDY is a 300mm wafer processing platform that combines the advantages of the TELFORMULA and ALPHA(α)-303i platforms to meet the demands of high-volume thermal processing for sub-45nm technology. It offers a large 125-wafer batch size, high-speed robotics, and other improvements for cost-effective processing of various oxidation and deposited films. The TELINDY platform is suitable for a range of applications, including general oxidation/anneal, radical oxidation, LPCVD films, ultra-low temperature LPCVD applications, and high-k dielectrics. It features in-situ dry gas cleaning technology, a fast ramp-up and cool-down heater, high-speed robotics, and a large 125-wafer load size. These features make the TELINDY an excellent choice for cost-effective and efficient wafer processing.문서
문서 없음
TEL / TOKYO ELECTRON
TELINDY
검증됨
카테고리
Furnaces / Diffusion
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
103932
웨이퍼 사이즈:
12"/300mm
빈티지:
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
TEL / TOKYO ELECTRON
TELINDY
카테고리
Furnaces / Diffusion
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
103932
웨이퍼 사이즈:
12"/300mm
빈티지:
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Tel Indy IRAD환경 설정
Asset Description: TEL Furnace Software Version: 6.01 CIM: secs-gem Process: MLD Nitride Main System: Tel Indy Mainframe (1) Factory Interface: FOUP (2) Options System: Gas Detector box (1) Options System: RCU (Rapid Cooling Unit) (1) 208VAC UPS (1) Rapid cooling unit (1)OEM 모델 설명
The TELINDY is a 300mm wafer processing platform that combines the advantages of the TELFORMULA and ALPHA(α)-303i platforms to meet the demands of high-volume thermal processing for sub-45nm technology. It offers a large 125-wafer batch size, high-speed robotics, and other improvements for cost-effective processing of various oxidation and deposited films. The TELINDY platform is suitable for a range of applications, including general oxidation/anneal, radical oxidation, LPCVD films, ultra-low temperature LPCVD applications, and high-k dielectrics. It features in-situ dry gas cleaning technology, a fast ramp-up and cool-down heater, high-speed robotics, and a large 125-wafer load size. These features make the TELINDY an excellent choice for cost-effective and efficient wafer processing.문서
문서 없음