설명
Laser Saw환경 설정
환경 설정 없음OEM 모델 설명
The Laser1205 platform is a family of systems specially developed for the separation and/or grooving of semiconductor wafers by means of laser energy. The family contains fully automated systems designed for sustained high quality production in an industrial environment.문서
문서 없음
ASMPT
LASER1205
검증됨
카테고리
Laser
마지막 검증일: 24일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
113834
웨이퍼 사이즈:
6"/150mm
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ASMPT
LASER1205
카테고리
Laser
마지막 검증일: 24일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
113834
웨이퍼 사이즈:
6"/150mm
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Laser Saw환경 설정
환경 설정 없음OEM 모델 설명
The Laser1205 platform is a family of systems specially developed for the separation and/or grooving of semiconductor wafers by means of laser energy. The family contains fully automated systems designed for sustained high quality production in an industrial environment.문서
문서 없음