설명
설명 없음환경 설정
Minimum Spot Size (1/e2): 2.0μm Accuracy: .20μm Wavelength: 1.3μm – LightWave Laser rep rate: 30kHz Maximum cut velocity: 200mm/second Wafer Diameter 200mm / 300mm.(S‐type for 150mm)OEM 모델 설명
The Model 9820 is based on ESI’s highly successful 98XX platform, which was developed specifically for advanced DRAM, SRAM, embedded memory and other laser fuse applications. The 9820 offers a wide process window, and small spot sizes to address the requirements of most high-speed chips. The large-field 98XX platform minimizes alignment, stepping and other overhead factors that impact throughput, while auto-adjusting optics keep optical components perfectly aligned for optimal process performance and highest productivity. Capable of processing new generations of tight pitch fuses Designed for high volume, automated 300 mm production Wide range of processing applications – Poly Si, Al, and Cu capable New high-performance laser option문서
문서 없음
ESI
9820
검증됨
카테고리
Laser
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Deinstalled
제품 ID:
105420
웨이퍼 사이즈:
6"/150mm, 8"/200mm, 12"/300mm
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ESI
9820
카테고리
Laser
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Deinstalled
제품 ID:
105420
웨이퍼 사이즈:
6"/150mm, 8"/200mm, 12"/300mm
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
Minimum Spot Size (1/e2): 2.0μm Accuracy: .20μm Wavelength: 1.3μm – LightWave Laser rep rate: 30kHz Maximum cut velocity: 200mm/second Wafer Diameter 200mm / 300mm.(S‐type for 150mm)OEM 모델 설명
The Model 9820 is based on ESI’s highly successful 98XX platform, which was developed specifically for advanced DRAM, SRAM, embedded memory and other laser fuse applications. The 9820 offers a wide process window, and small spot sizes to address the requirements of most high-speed chips. The large-field 98XX platform minimizes alignment, stepping and other overhead factors that impact throughput, while auto-adjusting optics keep optical components perfectly aligned for optimal process performance and highest productivity. Capable of processing new generations of tight pitch fuses Designed for high volume, automated 300 mm production Wide range of processing applications – Poly Si, Al, and Cu capable New high-performance laser option문서
문서 없음