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설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
-High power laser system enables the complete decapsulation on IC packages to the exposure of Cu, Al, Au without damaging them. -High efficient laser enables partial decap to silicon die surface for acid or chemical clean-up operations when post electrical verification required -Isolated sample room to prevent cross contamination to other equipment parts to improve operational life span -High resolution real time video during laser decap process문서
문서 없음
카테고리
Laser
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
69542
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
RADIANT
LASER ETCH 2
카테고리
Laser
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
69542
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
-High power laser system enables the complete decapsulation on IC packages to the exposure of Cu, Al, Au without damaging them. -High efficient laser enables partial decap to silicon die surface for acid or chemical clean-up operations when post electrical verification required -Isolated sample room to prevent cross contamination to other equipment parts to improve operational life span -High resolution real time video during laser decap process문서
문서 없음