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VEECO / ULTRATECH AP200
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    OEM 모델 설명
    The Ultratech AP200 is part of the AP200/300 family of lithography systems that delivers superior performance in terms of overlay, resolution, and side wall profile. These systems are highly automated and cost-effective, making them well-suited for applications such as copper pillar, fan-out, through-silicon via (TSV), and silicon interposer. The platform also has numerous application-specific features that enable next-generation packaging techniques, including enhanced warped wafer handling, dual side alignment, and optical focus.
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    VEECO / ULTRATECH

    AP200

    verified-listing-icon

    검증됨

    카테고리
    Lithography

    마지막 검증일: 60일 이상 전

    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    113475


    웨이퍼 사이즈:

    8"/200mm


    빈티지:

    알 수 없음


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    유사 등재물
    모두 보기
    VEECO / ULTRATECH AP200

    VEECO / ULTRATECH

    AP200

    Lithography
    빈티지: 0조건: 중고
    마지막 검증일60일 이상 전

    VEECO / ULTRATECH

    AP200

    verified-listing-icon
    검증됨
    카테고리
    Lithography
    마지막 검증일: 60일 이상 전
    listing-photo-625095c2dd134e319d3add419659a7f9-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    113475


    웨이퍼 사이즈:

    8"/200mm


    빈티지:

    알 수 없음


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    설명
    설명 없음
    환경 설정
    환경 설정 없음
    OEM 모델 설명
    The Ultratech AP200 is part of the AP200/300 family of lithography systems that delivers superior performance in terms of overlay, resolution, and side wall profile. These systems are highly automated and cost-effective, making them well-suited for applications such as copper pillar, fan-out, through-silicon via (TSV), and silicon interposer. The platform also has numerous application-specific features that enable next-generation packaging techniques, including enhanced warped wafer handling, dual side alignment, and optical focus.
    문서

    문서 없음

    유사 등재물
    모두 보기
    VEECO / ULTRATECH AP200

    VEECO / ULTRATECH

    AP200

    Lithography빈티지: 0조건: 중고마지막 검증일:60일 이상 전
    VEECO / ULTRATECH AP200

    VEECO / ULTRATECH

    AP200

    Lithography빈티지: 0조건: 중고마지막 검증일:60일 이상 전
    VEECO / ULTRATECH AP200

    VEECO / ULTRATECH

    AP200

    Lithography빈티지: 0조건: 중고마지막 검증일:60일 이상 전