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설명
Tool is deinstalled and crated환경 설정
– Wafer Configuration: 9″ inch mask holder square, 8″ wafer chuck – Double-sided / Backside Alignment Capability – Manual Load – Motorized illuminator 1000w lamp (joystick)– Manual XYZ stage (coarse and fine adjustments– Includes: PC, Lamp, Mirror and OptOEM 모델 설명
The EVG6200∞ Alignment System is a high-throughput, reliable, and accurate system for handling wafers and substrates up to 200mm. It features EV Group’s NanoAlign Technology for high alignment accuracy and resolution, making it competitive in full-field lithography. It is designed for wafer bumping, chip scale packaging, MEMS, Compound Semiconductor, Power Devices, and Nanotechnology applications. The system has a high degree of automation and can handle multiple wafer sizes with quick change-over time. It also has options for cassette-to-cassette handling, automatic alignment, and field upgrades.문서
문서 없음
카테고리
Mask/Bond Aligners
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
51170
웨이퍼 사이즈:
8"/200mm
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG6200-Infinity
카테고리
Mask/Bond Aligners
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
51170
웨이퍼 사이즈:
8"/200mm
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Tool is deinstalled and crated환경 설정
– Wafer Configuration: 9″ inch mask holder square, 8″ wafer chuck – Double-sided / Backside Alignment Capability – Manual Load – Motorized illuminator 1000w lamp (joystick)– Manual XYZ stage (coarse and fine adjustments– Includes: PC, Lamp, Mirror and OptOEM 모델 설명
The EVG6200∞ Alignment System is a high-throughput, reliable, and accurate system for handling wafers and substrates up to 200mm. It features EV Group’s NanoAlign Technology for high alignment accuracy and resolution, making it competitive in full-field lithography. It is designed for wafer bumping, chip scale packaging, MEMS, Compound Semiconductor, Power Devices, and Nanotechnology applications. The system has a high degree of automation and can handle multiple wafer sizes with quick change-over time. It also has options for cassette-to-cassette handling, automatic alignment, and field upgrades.문서
문서 없음