설명
Al, Ta Sputtering Process The C2 is using Ta-Al, Al-Cu targets for PVD sputtering on 6 inches wafers. The film is Ta-Al 1100 Ao, Al-Cu 5200 Ao. The production run rate is 75 wafers every pump down which translates to 2 hrs. Normally the machine can do 5-6 pump down on a 12 hours shift. That translates to about 375-450 wafers output per shift or 750-900 wafers per day. The current layout is Loadlock, Orienter / Desorb, Transport, 2 Process Chambers. More process chambers can be added depending on process needs. Each process chamber is equipped with an on-board 8 CryoPump.환경 설정
-Cassette Load Lock Modules - Come with 3 casettes, a Motion Engineering Inc (MEI) 3 axis single arms robot, - Leybold TMP/NT 150/360V/H turbo pump -Desorb Modules For wafer orientation and lamps heating, Leybold TMP/NT 150/360V/H turbo pump -Transport Modules Brooks MultiTran 5 Bi-symmetric frog-leg type dual arm robot. Leybold TMP 151/361, 600 and 1000 turbo pump. -PVD Cathode AE MDX Magatron Drive Power Supply . CTI cryo on board 8 and 8300 compressor. VAT Gate valve series 14 AlCu target 14” diameter -PVD Cathode Same as 4. TaAl target 14” diameterOEM 모델 설명
The NOVELLUS CONCEPT TWO is a modular, integrated production system that is capable of depositing both dielectric and conductive metal layers by combining one or more processing chambers around a common, automated robotic wafer handler. It was introduced in November 1991.문서
문서 없음
LAM RESEARCH / NOVELLUS
CONCEPT TWO "C2"
검증됨
카테고리
MOCVD
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
45660
웨이퍼 사이즈:
6"/150mm
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
LAM RESEARCH / NOVELLUS
CONCEPT TWO "C2"
카테고리
MOCVD
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
45660
웨이퍼 사이즈:
6"/150mm
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Al, Ta Sputtering Process The C2 is using Ta-Al, Al-Cu targets for PVD sputtering on 6 inches wafers. The film is Ta-Al 1100 Ao, Al-Cu 5200 Ao. The production run rate is 75 wafers every pump down which translates to 2 hrs. Normally the machine can do 5-6 pump down on a 12 hours shift. That translates to about 375-450 wafers output per shift or 750-900 wafers per day. The current layout is Loadlock, Orienter / Desorb, Transport, 2 Process Chambers. More process chambers can be added depending on process needs. Each process chamber is equipped with an on-board 8 CryoPump.환경 설정
-Cassette Load Lock Modules - Come with 3 casettes, a Motion Engineering Inc (MEI) 3 axis single arms robot, - Leybold TMP/NT 150/360V/H turbo pump -Desorb Modules For wafer orientation and lamps heating, Leybold TMP/NT 150/360V/H turbo pump -Transport Modules Brooks MultiTran 5 Bi-symmetric frog-leg type dual arm robot. Leybold TMP 151/361, 600 and 1000 turbo pump. -PVD Cathode AE MDX Magatron Drive Power Supply . CTI cryo on board 8 and 8300 compressor. VAT Gate valve series 14 AlCu target 14” diameter -PVD Cathode Same as 4. TaAl target 14” diameterOEM 모델 설명
The NOVELLUS CONCEPT TWO is a modular, integrated production system that is capable of depositing both dielectric and conductive metal layers by combining one or more processing chambers around a common, automated robotic wafer handler. It was introduced in November 1991.문서
문서 없음