설명
설명 없음환경 설정
With Touch Panel CE mark SECS/GEM WPH : 65 PcsFully automated tape laminator MSA840VIII Semi auto vacuum mounter Tape: PW3615MT Cutter temperature: 120°C Table temperature: 90°C Roller temperature: 60°C Lamination speed: 10 to 2 mm / sec (Changed motor gear to low) Lamination pressure: 0.3 to 0.5 MPa (Dual press roller) Pre heat: 100°C, 5 min Heat up on hot plate: 200°C, 10 min Taper, 4"-8" Power supply: 110 V.OEM 모델 설명
This equipment applies protection tape on the wafer patterned surface for the back-grinding process. Full-auto type & Semi-auto type machines are lined up, and large size wafers are also available.문서
문서 없음
NITTO
DR8500III
검증됨
카테고리
Packaging
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
65683
웨이퍼 사이즈:
알 수 없음
빈티지:
2017
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기NITTO
DR8500III
카테고리
Packaging
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
65683
웨이퍼 사이즈:
알 수 없음
빈티지:
2017
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
With Touch Panel CE mark SECS/GEM WPH : 65 PcsFully automated tape laminator MSA840VIII Semi auto vacuum mounter Tape: PW3615MT Cutter temperature: 120°C Table temperature: 90°C Roller temperature: 60°C Lamination speed: 10 to 2 mm / sec (Changed motor gear to low) Lamination pressure: 0.3 to 0.5 MPa (Dual press roller) Pre heat: 100°C, 5 min Heat up on hot plate: 200°C, 10 min Taper, 4"-8" Power supply: 110 V.OEM 모델 설명
This equipment applies protection tape on the wafer patterned surface for the back-grinding process. Full-auto type & Semi-auto type machines are lined up, and large size wafers are also available.문서
문서 없음