설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
VECTOR Q Strata is a product in the VECTOR family of Lam Research Corporation. It is designed to provide the performance and flexibility needed to create enabling structures and meet the demands of challenging applications in the semiconductor industry. The VECTOR family uses Plasma-Enhanced Chemical Vapor Deposition (PECVD) and Plasma-Enhanced Atomic Layer Deposition (ALD) technologies to deposit high-quality dielectric films that meet exacting thickness, feature coverage, and stress, electrical, and mechanical requirements. The VECTOR Q Strata offers superior thin film quality, exceptional wafer-to-wafer uniformity, best-in-class productivity, low cost of ownership, and broad process flexibility enabled by Multi-Station Sequential Deposition (MSSD) architecture. It also features proprietary technology for controlling wafer heat-up independent of film deposition, improving film quality and reducing processing time.문서
문서 없음
카테고리
PECVD
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
124384
웨이퍼 사이즈:
12"/300mm
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LAM RESEARCH / NOVELLUS
VECTOR Q STRATA
카테고리
PECVD
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
124384
웨이퍼 사이즈:
12"/300mm
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
VECTOR Q Strata is a product in the VECTOR family of Lam Research Corporation. It is designed to provide the performance and flexibility needed to create enabling structures and meet the demands of challenging applications in the semiconductor industry. The VECTOR family uses Plasma-Enhanced Chemical Vapor Deposition (PECVD) and Plasma-Enhanced Atomic Layer Deposition (ALD) technologies to deposit high-quality dielectric films that meet exacting thickness, feature coverage, and stress, electrical, and mechanical requirements. The VECTOR Q Strata offers superior thin film quality, exceptional wafer-to-wafer uniformity, best-in-class productivity, low cost of ownership, and broad process flexibility enabled by Multi-Station Sequential Deposition (MSSD) architecture. It also features proprietary technology for controlling wafer heat-up independent of film deposition, improving film quality and reducing processing time.문서
문서 없음