설명
설명 없음환경 설정
3 Magnetron Sputtering Cathodes up to 10KW (T1 MRC Planar DC/RF, T2 MRC Inset DC, T3 MRC Inset DC) 1 AE MDX Power Supply 10 KW 1 Cryo Pump CTI 8 Installed in Process Chamber (NO Cryo in LL) 1 Cryo Compressor CTI 8200 1 Etch Station (Hard Etch 13,56 Mhz, ENI ACG-10B) 1 Heat Station in Etch Position Real Time Controller PLC Mitsubishi Windows PC for User InterfaceOEM 모델 설명
The MRC 603 is a sputter system designed to deposit thin film metals by DC source. It can hold four 6-inch wafers on a pallet for the process. The tool can be used to deposit aluminum (Al), titanium (Ti), and indium-tin-oxide (ITO) for single or multi-stack films like an Al/Ti문서
문서 없음
KDF / MRC
603
카테고리
PVD / Sputtering
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
128787
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
3 Magnetron Sputtering Cathodes up to 10KW (T1 MRC Planar DC/RF, T2 MRC Inset DC, T3 MRC Inset DC) 1 AE MDX Power Supply 10 KW 1 Cryo Pump CTI 8 Installed in Process Chamber (NO Cryo in LL) 1 Cryo Compressor CTI 8200 1 Etch Station (Hard Etch 13,56 Mhz, ENI ACG-10B) 1 Heat Station in Etch Position Real Time Controller PLC Mitsubishi Windows PC for User InterfaceOEM 모델 설명
The MRC 603 is a sputter system designed to deposit thin film metals by DC source. It can hold four 6-inch wafers on a pallet for the process. The tool can be used to deposit aluminum (Al), titanium (Ti), and indium-tin-oxide (ITO) for single or multi-stack films like an Al/Ti문서
문서 없음