설명
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80 Plus RIE Single Chamber RIE, non-load locked Ideal for R&D reactive ion etch applications System setup with universal quartz platen (with ability to place various size(s) of substrates) Up to 200mm wafer capable System PC, Keyboard, Mouse AE RF600A RF Generator Trivac D60AC Rough Pump (or equivalent) Alcatel ATP400 Turbo Pump Chiller Operations Manual and Documentation Fully Refurbished to excellent condition Gas Box Currently Configured for: - N2 - Ar - O2 - SF6 - CHF3 Oxford Refurbishment Process Consists of: Chamber disassembled for refurbishment. Chamber received full wet clean. Chamber o-rings and seals are replaced with brand new. All MFCs rebuilt and calibrated professionally. All corrosive gas lines replaced with brand new. All Non-corrosive gas lines purged. Vacuum pumps professionally rebuilt. Turbo pump professionally rebuilt. Chiller fully tested. All wiring/wire harnesses are checked, repaired or replaced if needed. All liquid and air lines, tubing and fittings checked and replaced if necessary. Major components disassembled for checkout, servicing, cleaning and lubricating. Parts are repaired or replaced as needed. Checkout of all electronic and mechanical parts. Machine covers are cleaned, polished or replaced as neededOEM 모델 설명
The Oxford Plasmalab80Plus is a compact plasma processing system that can perform high-quality plasma-enhanced chemical vapor deposition (PECVD) of materials such as SiOx, SiNx, and SiOxNy. This system is suitable for a variety of applications, including the creation of photonics structures, passivation, and hard masks. The Plasmalab80Plus has a small footprint and offers versatile etch and deposition solutions with easy open loading. It is simple to install and operate, while still delivering excellent process quality. The open load design allows for quick wafer loading and unloading, making it ideal for research, prototyping, and low-volume production. The system also enables high-performance processes through optimized electrode cooling and precise substrate temperature control.문서
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OXFORD
PLASMALAB 80 PLUS
검증됨
카테고리
PECVD
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Refurbished
작동 상태:
알 수 없음
제품 ID:
79133
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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모두 보기
OXFORD
PLASMALAB 80 PLUS
카테고리
PECVD
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Refurbished
작동 상태:
알 수 없음
제품 ID:
79133
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
80 Plus RIE Single Chamber RIE, non-load locked Ideal for R&D reactive ion etch applications System setup with universal quartz platen (with ability to place various size(s) of substrates) Up to 200mm wafer capable System PC, Keyboard, Mouse AE RF600A RF Generator Trivac D60AC Rough Pump (or equivalent) Alcatel ATP400 Turbo Pump Chiller Operations Manual and Documentation Fully Refurbished to excellent condition Gas Box Currently Configured for: - N2 - Ar - O2 - SF6 - CHF3 Oxford Refurbishment Process Consists of: Chamber disassembled for refurbishment. Chamber received full wet clean. Chamber o-rings and seals are replaced with brand new. All MFCs rebuilt and calibrated professionally. All corrosive gas lines replaced with brand new. All Non-corrosive gas lines purged. Vacuum pumps professionally rebuilt. Turbo pump professionally rebuilt. Chiller fully tested. All wiring/wire harnesses are checked, repaired or replaced if needed. All liquid and air lines, tubing and fittings checked and replaced if necessary. Major components disassembled for checkout, servicing, cleaning and lubricating. Parts are repaired or replaced as needed. Checkout of all electronic and mechanical parts. Machine covers are cleaned, polished or replaced as neededOEM 모델 설명
The Oxford Plasmalab80Plus is a compact plasma processing system that can perform high-quality plasma-enhanced chemical vapor deposition (PECVD) of materials such as SiOx, SiNx, and SiOxNy. This system is suitable for a variety of applications, including the creation of photonics structures, passivation, and hard masks. The Plasmalab80Plus has a small footprint and offers versatile etch and deposition solutions with easy open loading. It is simple to install and operate, while still delivering excellent process quality. The open load design allows for quick wafer loading and unloading, making it ideal for research, prototyping, and low-volume production. The system also enables high-performance processes through optimized electrode cooling and precise substrate temperature control.문서
문서 없음