설명
설명 없음환경 설정
-Voltage : 3Φ 220V -FULL LOAD AMPS : 18A -MACHINE MAIN BREAKER RATING : 20A -AMPERE RATING OF LARGEST LOAD : 10A -Cleaning station, -PVA spin coating system; -Quartz chuck; -12X.99hr laser running -Laser : 355nm /15W -8 /12 inches wafer sawOEM 모델 설명
The DFL7160 is a fully automatic laser saw that is compatible with 300 mm wafers. It uses a pulse laser to achieve non-thermal processing and supports various applications, including full cut and DAF cut. This model has seen wide use in many applications such as GaAs full cut and DAF cut after DBG. To prevent wafer contamination from laser processing particles, the DFL7160 can be equipped with the HogoMax coating/cleaning mechanism, which is a water-soluble protective film that prevents laser processing particles from adhering to the wafer surface. This makes the DFL7160 a versatile and reliable tool for wafer processing.문서
문서 없음
DISCO
DFL7160
검증됨
카테고리
Scribing, Cutting, Dicing
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
65537
웨이퍼 사이즈:
알 수 없음
빈티지:
2009
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
DISCO
DFL7160
카테고리
Scribing, Cutting, Dicing
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
65537
웨이퍼 사이즈:
알 수 없음
빈티지:
2009
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
-Voltage : 3Φ 220V -FULL LOAD AMPS : 18A -MACHINE MAIN BREAKER RATING : 20A -AMPERE RATING OF LARGEST LOAD : 10A -Cleaning station, -PVA spin coating system; -Quartz chuck; -12X.99hr laser running -Laser : 355nm /15W -8 /12 inches wafer sawOEM 모델 설명
The DFL7160 is a fully automatic laser saw that is compatible with 300 mm wafers. It uses a pulse laser to achieve non-thermal processing and supports various applications, including full cut and DAF cut. This model has seen wide use in many applications such as GaAs full cut and DAF cut after DBG. To prevent wafer contamination from laser processing particles, the DFL7160 can be equipped with the HogoMax coating/cleaning mechanism, which is a water-soluble protective film that prevents laser processing particles from adhering to the wafer surface. This makes the DFL7160 a versatile and reliable tool for wafer processing.문서
문서 없음