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Laser Grooving환경 설정
환경 설정 없음OEM 모델 설명
The DFL7160 is a fully automatic laser saw that is compatible with 300 mm wafers. It uses a pulse laser to achieve non-thermal processing and supports various applications, including full cut and DAF cut. This model has seen wide use in many applications such as GaAs full cut and DAF cut after DBG. To prevent wafer contamination from laser processing particles, the DFL7160 can be equipped with the HogoMax coating/cleaning mechanism, which is a water-soluble protective film that prevents laser processing particles from adhering to the wafer surface. This makes the DFL7160 a versatile and reliable tool for wafer processing.문서
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DISCO
DFL7160
카테고리
Scribing, Cutting, Dicing
마지막 검증일: 10일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
123069
웨이퍼 사이즈:
6"/150mm, 8"/200mm, 12"/300mm
빈티지:
2008
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설명
Laser Grooving환경 설정
환경 설정 없음OEM 모델 설명
The DFL7160 is a fully automatic laser saw that is compatible with 300 mm wafers. It uses a pulse laser to achieve non-thermal processing and supports various applications, including full cut and DAF cut. This model has seen wide use in many applications such as GaAs full cut and DAF cut after DBG. To prevent wafer contamination from laser processing particles, the DFL7160 can be equipped with the HogoMax coating/cleaning mechanism, which is a water-soluble protective film that prevents laser processing particles from adhering to the wafer surface. This makes the DFL7160 a versatile and reliable tool for wafer processing.문서
문서 없음