설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
Achieves high productivity for sapphire, lithium tantalate, and MEMS processing Φ200 mm Stealth Dicing™ SDBG SDTT DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide used in applications such as LED sapphire substrates and silicon microphones. Stealth Dicing™ process makes it possible for brittle materials such as SiC and GaN to be singulated without chipping. This is a completely dry process, making it suitable for processing devices such as MEMS that are susceptible to water damage.문서
문서 없음
DISCO
DFL7341
카테고리
Scribing, Cutting, Dicing
마지막 검증일: 16일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
152281
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
Achieves high productivity for sapphire, lithium tantalate, and MEMS processing Φ200 mm Stealth Dicing™ SDBG SDTT DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide used in applications such as LED sapphire substrates and silicon microphones. Stealth Dicing™ process makes it possible for brittle materials such as SiC and GaN to be singulated without chipping. This is a completely dry process, making it suitable for processing devices such as MEMS that are susceptible to water damage.문서
문서 없음