메인 콘텐츠로 건너뛰기
Moov logo

Moov Icon
HITACHI RS-4000
    설명
    설명 없음
    환경 설정
    Defect Review Sem
    OEM 모델 설명
    The RS-4000 performs at a high throughput of 1,200 DPH (defects per hour), which is about 3 times faster than the conventional model, and performs defect review at a high speed and high defect capture rate thereby improving image resolution (3 nm) and enhancing image processing. Combined with ADC (automatic defect classification) to identify killer defects, the tool produces data directly linked with yield enhancement in a short time. Furthermore, the newly added function of tilt image observation by tilting the electron beam enables the tool to generate more defect information.
    문서

    문서 없음

    카테고리
    SEM / FIB

    마지막 검증일: 60일 이상 전

    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    117087


    웨이퍼 사이즈:

    8"/200mm


    빈티지:

    2003


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available

    HITACHI

    RS-4000

    verified-listing-icon
    검증됨
    카테고리
    SEM / FIB
    마지막 검증일: 60일 이상 전
    listing-photo-16cfbb548f4a4abe9415486164da54a4-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    117087


    웨이퍼 사이즈:

    8"/200mm


    빈티지:

    2003


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    설명
    설명 없음
    환경 설정
    Defect Review Sem
    OEM 모델 설명
    The RS-4000 performs at a high throughput of 1,200 DPH (defects per hour), which is about 3 times faster than the conventional model, and performs defect review at a high speed and high defect capture rate thereby improving image resolution (3 nm) and enhancing image processing. Combined with ADC (automatic defect classification) to identify killer defects, the tool produces data directly linked with yield enhancement in a short time. Furthermore, the newly added function of tilt image observation by tilting the electron beam enables the tool to generate more defect information.
    문서

    문서 없음