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설명
The Hitachi S-7000 CD SEM is an in-process evaluation tool for monitoring wafers during the during the various process steps. Non-destructive wafer inspection is ideal for observing complete wafers to identify problems such as stacking-faults, deep holes, etc. Wafer Size: Accommodates 4", 5" and 6" wafers. Set size = 5". Secondary Electron Image Resolution: 15nm (150 angstroms) at 1kV Magnification: 100x to 100,000x CD Measurement Range: 0.05 to 100 microns Electron Beam Source: Field emission electron gun Accelerating Voltage(V0): 0.7~3kV (in increments of 100V) Emission Extracting Voltage(V1): 0~6.3kV Lens System: 2-stage electromagnetic lens reduction Objective Lens Aperture: Moveable type(4 openings selectable and alignable outside column Stigmator: 8-pole electromagnetic type(X,Y) Scanning Coil: 2-stage electromagnetic type Specimen Stage Movement: X-direction = 150nm, Y-direction = 150nm, Z-direction (working distance) = 5 to 15mm, T (tilt) angle = 0 to 60 degrees, R (rotation) angle = 360 degrees Wafer Holder: Holder replaceable for each wafer size Wafer Setting: Auto vacuum chucking using orientation flat reference Wafer Transfer: Wafer cassette to wafer holder in loader chamber (automatic) Auto Loader: Single-cassette loading, random accessing환경 설정
환경 설정 없음OEM 모델 설명
미제공문서
문서 없음
PREFERRED
SELLER
카테고리
SEM / FIB
마지막 검증일: 9일 전
Buyer pays 12% premium of final sale price
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
125823
웨이퍼 사이즈:
알 수 없음
빈티지:
1991
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PREFERRED
SELLER
HITACHI
S-7000
카테고리
SEM / FIB
마지막 검증일: 9일 전
Buyer pays 12% premium of final sale price
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
125823
웨이퍼 사이즈:
알 수 없음
빈티지:
1991
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
The Hitachi S-7000 CD SEM is an in-process evaluation tool for monitoring wafers during the during the various process steps. Non-destructive wafer inspection is ideal for observing complete wafers to identify problems such as stacking-faults, deep holes, etc. Wafer Size: Accommodates 4", 5" and 6" wafers. Set size = 5". Secondary Electron Image Resolution: 15nm (150 angstroms) at 1kV Magnification: 100x to 100,000x CD Measurement Range: 0.05 to 100 microns Electron Beam Source: Field emission electron gun Accelerating Voltage(V0): 0.7~3kV (in increments of 100V) Emission Extracting Voltage(V1): 0~6.3kV Lens System: 2-stage electromagnetic lens reduction Objective Lens Aperture: Moveable type(4 openings selectable and alignable outside column Stigmator: 8-pole electromagnetic type(X,Y) Scanning Coil: 2-stage electromagnetic type Specimen Stage Movement: X-direction = 150nm, Y-direction = 150nm, Z-direction (working distance) = 5 to 15mm, T (tilt) angle = 0 to 60 degrees, R (rotation) angle = 360 degrees Wafer Holder: Holder replaceable for each wafer size Wafer Setting: Auto vacuum chucking using orientation flat reference Wafer Transfer: Wafer cassette to wafer holder in loader chamber (automatic) Auto Loader: Single-cassette loading, random accessing환경 설정
환경 설정 없음OEM 모델 설명
미제공문서
문서 없음