설명
Wafer Test환경 설정
환경 설정 없음OEM 모델 설명
The QS2200 is a 200mm FTIR metrology tool designed for non-destructive wafer analysis. It is used for the characterization and measurement of semiconductor materials and device manufacturing. The QS2200 model is available in two configurations: the QS2200A, an automated system with two open cassette stations, and the QS2200ME, an automated system with an indexer and open cassette system. The QS2200 series incorporates a universal stage that adjusts automatically to different wafer sizes (100, 125, 150, and 200mm) and unique algorithms that deliver instant qualification of SOI, SiC, and other epitaxial films. Additionally, it is versatile enough to qualify the thickness of recycled test wafers for rapid payback. This tool is built with intelligence that extends its applicability to almost every film material imaginable.문서
문서 없음
카테고리
Spectrometer / SIMS
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
125642
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ONTO / NANOMETRICS / ACCENT / BIO-RAD
QS-2200
카테고리
Spectrometer / SIMS
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
125642
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Wafer Test환경 설정
환경 설정 없음OEM 모델 설명
The QS2200 is a 200mm FTIR metrology tool designed for non-destructive wafer analysis. It is used for the characterization and measurement of semiconductor materials and device manufacturing. The QS2200 model is available in two configurations: the QS2200A, an automated system with two open cassette stations, and the QS2200ME, an automated system with an indexer and open cassette system. The QS2200 series incorporates a universal stage that adjusts automatically to different wafer sizes (100, 125, 150, and 200mm) and unique algorithms that deliver instant qualification of SOI, SiC, and other epitaxial films. Additionally, it is versatile enough to qualify the thickness of recycled test wafers for rapid payback. This tool is built with intelligence that extends its applicability to almost every film material imaginable.문서
문서 없음