설명

Designed to optimize productivity for leading-edge 300mm wafer fabs, the AP300 system integrates the processing advantages associated with Ultratech’s industry-leading advanced packaging lithography equipment with the productivity benefits of the company’s new Unity Platform TM. Ultratech’s AP300 supports a lower cost-of-ownership strategy due to significant throughput enhancements, higher reliability, and superior alignment and illumination systems. In addition, utilizing non-contact 1X projection imaging technology greatly reduces the risk of lithography-related yield losses, while also providing the unique capabilities required for processing leading-edge advanced packaging devices. - Broadband illumination capability enables exposure of i-, gh- and ghi-line resists - Patented Machine Vision System (MVS) capability eliminates the need for dedicated alignment targets and simplifies process integration - Fully automatic wafer change supports 200 mm and 300 mm wafers - Improved wafer edge exposure and wafer edge exclusion capability provide customer productivity enhancements - Industry’s best equipment uptime along with self diagnostic capability and enhanced host communications - New platform enables a 20% productivity improvement, thereby supporting a lower cost-of-ownership strategy Details Attached

환경 설정

Resolution 4.0um Computer P4 within Window XP - Max aspect rect 44mm x 26.7mm Lamp Power Supply - High intensity, 1200 watt dual power supply Max Area Rect - 44mm x 26.7mm Voice Coil Isolated platen Exposure Wavelength - Broadband GHI Line Wafer Prealigner Uniformity < 3% Wafer Transfer Robot Wafer Plane Intensity >2000mw Reticle Stage Type - 6" x 6" x0.25" Linear XY Stage Monolithic Structure Machine Vision - Unity System Reticle Cooler Chuck - Universal Chuck Software Rev - Unity Focus - Extend focus 50 um Focus Gauge WEP Air Gauge

OEM 모델 설명

The ULTRATECH AP300 is a stepper and scanner system that can produce wafers of 200-300mm in size. It is built on Veeco’s customizable Unity Platform™, which delivers superior overlay, resolution, and side wall profile performance, enabling highly automated and cost-effective manufacturing. The AP300 is particularly well-suited for copper pillar, fan-out, through-silicon via (TSV), and silicon interposer applications. It also has numerous application-specific product features to enable next-generation packaging techniques, such as enhanced warped wafer handling, dual side alignment, and optical focus.