설명
-Illumination Source Type Multi-wavelength Source -Multi-Layer Film Capacity YES -Micro Spot Optics YES -Scanning Stage YES -Wafer Mapping YES -Refurbished YES -CE Marked YES환경 설정
Inspection Modes Include: Dual Beam Spectrometry Spectroscopic Ellipsometry Film Stress Analysis SUMMIT™ Application Software Version 3.21.16 FTML Version 3.46.06 Model 300DFF1P Wafer Loading Platform Dual Loadports for 300mm Wafers Three Axis Wafer Handling Robot GEM / SECS Communication Set Size 300 mmOEM 모델 설명
The ASET-F5x is a thin film metrology system that can measure materials across a continuous wavelength spectrum from 190 nm to 800 nm. It accurately measures complex multi-layer thin film stacks using spectroscopic ellipsometry and precisely measures advanced, ultra-thin gate dielectric films. It provides the accuracy, repeatability, and system-to-system matching required to monitor advanced ICs with geometries as small as 0.1 micron. Its applications include diffusion films/film deposition, CMP, lithography, and etch.문서
문서 없음
유사 등재물
모두 보기
KLA
ASET-F5x
카테고리
Thin Film / Film Thickness
마지막 검증일: 3일 전
주요 품목 세부 정보
조건:
Refurbished
작동 상태:
알 수 없음
제품 ID:
149084
웨이퍼 사이즈:
8"/200mm, 12"/300mm
빈티지:
2002
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
-Illumination Source Type Multi-wavelength Source -Multi-Layer Film Capacity YES -Micro Spot Optics YES -Scanning Stage YES -Wafer Mapping YES -Refurbished YES -CE Marked YES환경 설정
Inspection Modes Include: Dual Beam Spectrometry Spectroscopic Ellipsometry Film Stress Analysis SUMMIT™ Application Software Version 3.21.16 FTML Version 3.46.06 Model 300DFF1P Wafer Loading Platform Dual Loadports for 300mm Wafers Three Axis Wafer Handling Robot GEM / SECS Communication Set Size 300 mmOEM 모델 설명
The ASET-F5x is a thin film metrology system that can measure materials across a continuous wavelength spectrum from 190 nm to 800 nm. It accurately measures complex multi-layer thin film stacks using spectroscopic ellipsometry and precisely measures advanced, ultra-thin gate dielectric films. It provides the accuracy, repeatability, and system-to-system matching required to monitor advanced ICs with geometries as small as 0.1 micron. Its applications include diffusion films/film deposition, CMP, lithography, and etch.문서
문서 없음