설명
Provides precise, non-destructive thin film stress measurement via substrate curvature analysis, supporting process control, failure analysis, and R&D applications. Configured for wafer-based measurements with support for sizes up to approximately 200mm. Power: 115V / 1 Phase / 60Hz환경 설정
환경 설정 없음OEM 모델 설명
미제공문서
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KLA
FLX 2320A
카테고리
Thin Film / Film Thickness
마지막 검증일: 16일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
146114
웨이퍼 사이즈:
8"/200mm
빈티지:
1993
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Provides precise, non-destructive thin film stress measurement via substrate curvature analysis, supporting process control, failure analysis, and R&D applications. Configured for wafer-based measurements with support for sizes up to approximately 200mm. Power: 115V / 1 Phase / 60Hz환경 설정
환경 설정 없음OEM 모델 설명
미제공문서
문서 없음