설명
Description FUSION 150/3D Wafer Size Range Minimum 150 mm Maximum 200 mm Set Size 200 mm Power Requirements 380 V 14.0 A 50 Hz 3 Phase환경 설정
환경 설정 없음OEM 모델 설명
The Fusion 200PCU PoLo is a product from Axcelis Technologies that offers a cost-effective single chamber solution for processing 125-200mm wafers. It features a rapid, one-step UV Bake™ Process that replaces the standard resist hardbake, allowing for higher process margins and increased consistency within dry etch and ion implantation sequences. This makes it a valuable tool for improving the efficiency and effectiveness of semiconductor manufacturing processes.문서
문서 없음
카테고리
UV-Curing
마지막 검증일: 어제
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
121204
웨이퍼 사이즈:
6"/150mm, 8"/200mm
빈티지:
1996
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
AXCELIS / FUSION
200 PCU
카테고리
UV-Curing
마지막 검증일: 어제
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
121204
웨이퍼 사이즈:
6"/150mm, 8"/200mm
빈티지:
1996
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Description FUSION 150/3D Wafer Size Range Minimum 150 mm Maximum 200 mm Set Size 200 mm Power Requirements 380 V 14.0 A 50 Hz 3 Phase환경 설정
환경 설정 없음OEM 모델 설명
The Fusion 200PCU PoLo is a product from Axcelis Technologies that offers a cost-effective single chamber solution for processing 125-200mm wafers. It features a rapid, one-step UV Bake™ Process that replaces the standard resist hardbake, allowing for higher process margins and increased consistency within dry etch and ion implantation sequences. This makes it a valuable tool for improving the efficiency and effectiveness of semiconductor manufacturing processes.문서
문서 없음