설명

Wafer bonder

환경 설정

환경 설정 없음

OEM 모델 설명

A maximum level of automation and process integration is achieved with the GEMINI automated production wafer bonding system. Wafer-to-wafer alignment and wafer bonding processes up to 200 mm (300 mm) for volume manufacturing are all performed in one fully automated platform. Device manufacturers benefit from increased production output, a high integration level and a wide choice of bonding process methods like anodic, silicon fusion, thermo-compression and eutectic bonding.