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설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
A maximum level of automation and process integration is achieved with the GEMINI automated production wafer bonding system. Wafer-to-wafer alignment and wafer bonding processes up to 200 mm (300 mm) for volume manufacturing are all performed in one fully automated platform. Device manufacturers benefit from increased production output, a high integration level and a wide choice of bonding process methods like anodic, silicon fusion, thermo-compression and eutectic bonding.문서
문서 없음
카테고리
Wafer Bonders
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Refurbished
작동 상태:
Deinstalled
제품 ID:
102684
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
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EVGroup (EVG)
GEMINI
카테고리
Wafer Bonders
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Refurbished
작동 상태:
Deinstalled
제품 ID:
102684
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
A maximum level of automation and process integration is achieved with the GEMINI automated production wafer bonding system. Wafer-to-wafer alignment and wafer bonding processes up to 200 mm (300 mm) for volume manufacturing are all performed in one fully automated platform. Device manufacturers benefit from increased production output, a high integration level and a wide choice of bonding process methods like anodic, silicon fusion, thermo-compression and eutectic bonding.문서
문서 없음