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DFG850
카테고리
Wafer Grinding개요
The Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra-thin grinding for applications including 3D integration, BSI, bonded wafers, IC slim cards, and more.
활성 등재물
10
서비스
검사, 보험, 감정, 물류
