DFG840
카테고리
Wafer Grinding개요
The Disco DFG840 and 841 Systems have two-spindle, two-chuck table specifications and a robot arm. These machines feature a same-cassette return function. The robot arm vacuum ensures that even thin-ground wafers, which are prone to warping, are corrected to the required flatness for trouble-free handling.
활성 등재물
8
서비스
검사, 보험, 감정, 물류