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Wafer Grinder, w/ 6.2 Kw Spindle UpgradeOEM 모델 설명
The Disco DAG810 is a compact, automatic grinder for workpieces up to 8 inches in diameter. It has one spindle and one chuck table and is designed to process a variety of materials. It has a relatively small footprint of only 11 square feet.문서
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DISCO
DAG810
카테고리
Wafer Grinding
마지막 검증일: 25일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
119962
웨이퍼 사이즈:
6"/150mm
빈티지:
2017
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설명
설명 없음환경 설정
Wafer Grinder, w/ 6.2 Kw Spindle UpgradeOEM 모델 설명
The Disco DAG810 is a compact, automatic grinder for workpieces up to 8 inches in diameter. It has one spindle and one chuck table and is designed to process a variety of materials. It has a relatively small footprint of only 11 square feet.문서
문서 없음