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설명
Basic specifications: Workpiece diameter the machine can handle = Maximim 8" 4/5/6/8 when the universal check table is used. Workpiece thickness the machine can handle = Maximum 20 mm Grinding system = In-feed grinding by rotating workpiece Grinding wheel used = 20 mm (8'') diamond wheel Spindle section: Bearing type: Air bearing Number of axes: 1 Motor: 4.2 kw high-frequency motor Motor electric current: Displayed in real time on the monitor (with peak-hold function) Rotative speed: 1,000 to 7,000 min -1 Rotative speed command unit: 1 min -1환경 설정
환경 설정 없음OEM 모델 설명
The Disco DAG810 is a compact, automatic grinder for workpieces up to 8 inches in diameter. It has one spindle and one chuck table and is designed to process a variety of materials. It has a relatively small footprint of only 11 square feet.문서
유사 등재물
모두 보기
DISCO
DAG810
카테고리
Wafer Grinding
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
110343
웨이퍼 사이즈:
알 수 없음
빈티지:
2012
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