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DISCO DFG840
    설명
    Slicer Cutter Disco dfg840, a classic 8-inch wafer grinding equipment, can be compatible with 4-5-6-inch wafer. The equipment has good stability. The company has a professional after-sales team to provide relevant installation, commissioning and maintenance services. Rated power: ac200v, 50 / 60Hz, 17kwv Compressed air: 0.5MPa 300l/mi Grinding water: 0.2MPa 15L / min L cooling water: 0.2MPa 11L / min Weight: 2300kg
    환경 설정
    환경 설정 없음
    OEM 모델 설명
    The Disco DFG840 and 841 Systems have two-spindle, two-chuck table specifications and a robot arm. These machines feature a same-cassette return function. The robot arm vacuum ensures that even thin-ground wafers, which are prone to warping, are corrected to the required flatness for trouble-free handling.
    문서

    문서 없음

    DISCO

    DFG840

    verified-listing-icon

    검증됨

    카테고리
    Wafer Grinding

    마지막 검증일: 60일 이상 전

    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    79146


    웨이퍼 사이즈:

    알 수 없음


    빈티지:

    알 수 없음


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    유사 등재물
    모두 보기
    DISCO DFG840

    DISCO

    DFG840

    Wafer Grinding
    빈티지: 1995조건: 중고
    마지막 검증일15일 전

    DISCO

    DFG840

    verified-listing-icon
    검증됨
    카테고리
    Wafer Grinding
    마지막 검증일: 60일 이상 전
    listing-photo-0f396aa2fdb846a89125ca1a2f6e60b6-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1955/0f396aa2fdb846a89125ca1a2f6e60b6/3a3b2b23e7c244a7b44e9508866d35f0_dfg8401_mw.png
    listing-photo-0f396aa2fdb846a89125ca1a2f6e60b6-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1955/0f396aa2fdb846a89125ca1a2f6e60b6/ba60c7283bfc44908a69421bde45bb32_dfg8402_mw.png
    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    79146


    웨이퍼 사이즈:

    알 수 없음


    빈티지:

    알 수 없음


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    설명
    Slicer Cutter Disco dfg840, a classic 8-inch wafer grinding equipment, can be compatible with 4-5-6-inch wafer. The equipment has good stability. The company has a professional after-sales team to provide relevant installation, commissioning and maintenance services. Rated power: ac200v, 50 / 60Hz, 17kwv Compressed air: 0.5MPa 300l/mi Grinding water: 0.2MPa 15L / min L cooling water: 0.2MPa 11L / min Weight: 2300kg
    환경 설정
    환경 설정 없음
    OEM 모델 설명
    The Disco DFG840 and 841 Systems have two-spindle, two-chuck table specifications and a robot arm. These machines feature a same-cassette return function. The robot arm vacuum ensures that even thin-ground wafers, which are prone to warping, are corrected to the required flatness for trouble-free handling.
    문서

    문서 없음

    유사 등재물
    모두 보기
    DISCO DFG840

    DISCO

    DFG840

    Wafer Grinding빈티지: 1995조건: 중고마지막 검증일:15일 전
    DISCO DFG840

    DISCO

    DFG840

    Wafer Grinding빈티지: 0조건: 중고마지막 검증일:60일 이상 전
    DISCO DFG840

    DISCO

    DFG840

    Wafer Grinding빈티지: 0조건: 중고마지막 검증일:60일 이상 전