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Installed and running Complete with no missing parts환경 설정
Wafer Grinder for Silicon and Silicon Carbide, Spindle Upgrade Includes Disco DTU152 Water Temperature Control Unit 150mmOEM 모델 설명
The Disco DFG8540 is a fully automatic in-feed surface grinder. It has a conventional two-spindle, three-chuck design and is capable of performing both large diameter and thin-finish grinding. The processing position of the grinding wheel coincides with the chuck table for each spindle for improved grinding performance. The Disco DFG8540 supports workpiece sizes up to Φ8 inch and uses a Φ200 mm Diamond Wheel for grinding. The spindle has a rated output of 4.2 kW and a rotation speed range of 1,000 to 7,000 min-1. The equipment dimensions are 1,200 × 2,670 × 1,800 mm and it weighs approximately 3,100 kg.문서
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DISCO
DFG8540
카테고리
Wafer Grinding
마지막 검증일: 13일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Installed / Running
제품 ID:
124579
웨이퍼 사이즈:
6"/150mm
빈티지:
2021
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설명
Installed and running Complete with no missing parts환경 설정
Wafer Grinder for Silicon and Silicon Carbide, Spindle Upgrade Includes Disco DTU152 Water Temperature Control Unit 150mmOEM 모델 설명
The Disco DFG8540 is a fully automatic in-feed surface grinder. It has a conventional two-spindle, three-chuck design and is capable of performing both large diameter and thin-finish grinding. The processing position of the grinding wheel coincides with the chuck table for each spindle for improved grinding performance. The Disco DFG8540 supports workpiece sizes up to Φ8 inch and uses a Φ200 mm Diamond Wheel for grinding. The spindle has a rated output of 4.2 kW and a rotation speed range of 1,000 to 7,000 min-1. The equipment dimensions are 1,200 × 2,670 × 1,800 mm and it weighs approximately 3,100 kg.문서
문서 없음