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DISCO DFG8540
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    환경 설정
    환경 설정 없음
    OEM 모델 설명
    The Disco DFG8540 is a fully automatic in-feed surface grinder. It has a conventional two-spindle, three-chuck design and is capable of performing both large diameter and thin-finish grinding. The processing position of the grinding wheel coincides with the chuck table for each spindle for improved grinding performance. The Disco DFG8540 supports workpiece sizes up to Φ8 inch and uses a Φ200 mm Diamond Wheel for grinding. The spindle has a rated output of 4.2 kW and a rotation speed range of 1,000 to 7,000 min-1. The equipment dimensions are 1,200 × 2,670 × 1,800 mm and it weighs approximately 3,100 kg.
    문서

    문서 없음

    DISCO

    DFG8540

    verified-listing-icon

    검증됨

    카테고리
    Wafer Grinding

    마지막 검증일: 60일 이상 전

    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    99966


    웨이퍼 사이즈:

    알 수 없음


    빈티지:

    알 수 없음


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    유사 등재물
    모두 보기
    DISCO DFG8540

    DISCO

    DFG8540

    Wafer Grinding
    빈티지: 2003조건: 중고
    마지막 검증일30일 이상 전

    DISCO

    DFG8540

    verified-listing-icon
    검증됨
    카테고리
    Wafer Grinding
    마지막 검증일: 60일 이상 전
    listing-photo-d1e9100dd1be4c55b1ecf5a60cd93a19-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    99966


    웨이퍼 사이즈:

    알 수 없음


    빈티지:

    알 수 없음


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    설명
    설명 없음
    환경 설정
    환경 설정 없음
    OEM 모델 설명
    The Disco DFG8540 is a fully automatic in-feed surface grinder. It has a conventional two-spindle, three-chuck design and is capable of performing both large diameter and thin-finish grinding. The processing position of the grinding wheel coincides with the chuck table for each spindle for improved grinding performance. The Disco DFG8540 supports workpiece sizes up to Φ8 inch and uses a Φ200 mm Diamond Wheel for grinding. The spindle has a rated output of 4.2 kW and a rotation speed range of 1,000 to 7,000 min-1. The equipment dimensions are 1,200 × 2,670 × 1,800 mm and it weighs approximately 3,100 kg.
    문서

    문서 없음

    유사 등재물
    모두 보기
    DISCO DFG8540

    DISCO

    DFG8540

    Wafer Grinding빈티지: 2003조건: 중고마지막 검증일:30일 이상 전
    DISCO DFG8540

    DISCO

    DFG8540

    Wafer Grinding빈티지: 2010조건: 중고마지막 검증일:29일 전
    DISCO DFG8540

    DISCO

    DFG8540

    Wafer Grinding빈티지: 2015조건: 중고마지막 검증일:60일 이상 전