설명
Manufacturer: ENGIS Model: EJD-9BL Equipment Type: Double-Sided Lapping & Polishing Machine Lapping Plate Size (OD): 635 mm Carrier Type: DP12 Carrier Outer Diameter: 232.7 mm Lower Plate Speed: 10–40 rpm Main Motor Power: 3.7 kW Drive System: 4-Way Drive Power Supply: AC 200V, 3-Phase, 50/60Hz Machine Dimensions (W x D x H): 1,500 x 1,200 x 2,300 mm Machine Weight (Net): 2,000 kg환경 설정
환경 설정 없음OEM 모델 설명
The EJD-9BL is a double-sided polishing machine that belongs to the EJD series. It supports a wide range of lapping and CMP processing of conventional abrasives, diamond abrasive, and fixed abrasive plates. The standard full safety cover makes it suitable for use in a semiconductor manufacturing environment. Additionally, it comes with a variety of optional functions such as real-time part thickness detection, actual pressure monitor and control, and low-pressure, low-speed descent control of the upper surface lapping platen. These features are essential for simultaneous double-sided polishing of thin wafers.문서
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유사 등재물
모두 보기
ENGIS
EJD-9BL
카테고리
Wafer Lapping
마지막 검증일: 8일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
Deinstalled
제품 ID:
153625
웨이퍼 사이즈:
알 수 없음
빈티지:
2017
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Manufacturer: ENGIS Model: EJD-9BL Equipment Type: Double-Sided Lapping & Polishing Machine Lapping Plate Size (OD): 635 mm Carrier Type: DP12 Carrier Outer Diameter: 232.7 mm Lower Plate Speed: 10–40 rpm Main Motor Power: 3.7 kW Drive System: 4-Way Drive Power Supply: AC 200V, 3-Phase, 50/60Hz Machine Dimensions (W x D x H): 1,500 x 1,200 x 2,300 mm Machine Weight (Net): 2,000 kg환경 설정
환경 설정 없음OEM 모델 설명
The EJD-9BL is a double-sided polishing machine that belongs to the EJD series. It supports a wide range of lapping and CMP processing of conventional abrasives, diamond abrasive, and fixed abrasive plates. The standard full safety cover makes it suitable for use in a semiconductor manufacturing environment. Additionally, it comes with a variety of optional functions such as real-time part thickness detection, actual pressure monitor and control, and low-pressure, low-speed descent control of the upper surface lapping platen. These features are essential for simultaneous double-sided polishing of thin wafers.문서
문서 없음