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The IPEC 472 wafer polisher is a fully automated, precision tool for CMP polishing of semiconductor wafers used to achieve flatness, uniformity, and planarization on patterned/device wafers. The 472 features automatic wafer handling and is capable of two platen, two-step polishing processing to maximize wafer throughput capability and quality. Designed to planarize wafers from 100mm to 200mm, the 472 is ideally suited for materials polishing applications that require repeatability with operational and processing flexibility.